3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility
| Author | : Lih-Tyng Hwang |
| Publisher | : John Wiley & Sons |
| Total Pages | : 465 |
| Release | : 2018-03-28 |
| ISBN-10 | : 9781119289678 |
| ISBN-13 | : 111928967X |
| Rating | : 4/5 (67X Downloads) |
Download or read book 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility written by Lih-Tyng Hwang and published by John Wiley & Sons. This book was released on 2018-03-28 with total page 465 pages. Available in PDF, EPUB and Kindle. Book excerpt: An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and Minitab Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail Provides chapter-wise review questions and powerpoint slides as teaching tools
