This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture,

This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, an

Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still ba

This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design method

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers