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Advanced Materials for Thermal Management of Electronic Packaging
Language: en
Pages: 633
Authors: Xingcun Colin Tong
Categories: Technology & Engineering
Type: BOOK - Published: 2011-01-05 - Publisher: Springer Science & Business Media

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The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic in
Advanced Thermal Management Materials
Language: en
Pages: 163
Authors: Guosheng Jiang
Categories: Technology & Engineering
Type: BOOK - Published: 2012-09-13 - Publisher: Springer Science & Business Media

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Advanced Thermal Management Materials provides a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. These s
Advanced Materials for Thermal Management of Electronic Packaging
Language: en
Pages: 618
Authors: Xingcun Colin Tong Ph.D
Categories: Technology & Engineering
Type: BOOK - Published: 2011-07-21 - Publisher: Springer

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The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic in
Power Electronic Packaging
Language: en
Pages: 606
Authors: Yong Liu
Categories: Technology & Engineering
Type: BOOK - Published: 2012-02-15 - Publisher: Springer Science & Business Media

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Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic diffe
Heat Transfer
Language: en
Pages: 526
Authors: Younes Shabany
Categories: Science
Type: BOOK - Published: 2009-12-17 - Publisher: CRC Press

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The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In