Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect mater

The chapters covered in this book include emerging new techniques on sintering. Major experts in this field contributed to this book and presented their researc

"Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliabili

Bridging the gap between textbook science and real-world engineering and operational applications, this reference presents comprehensive and easy-to-follow summ

The recent rapid progress in wireless telecommunication, including the Internet of Things, 5th generation wireless systems, satellite broadcasting, and intellig