Compact Models and Measurement Techniques for High-Speed Interconnects provides detailed analysis of issues related to high-speed interconnects from the perspec

Dramatic increases in processing power have rapidly scaled on-chip aggregate bandwidths into the Tb/s range. This necessitates a corresponding increase in the a

Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration req

The book provides a detailed analysis of issues related to sub-threshold interconnect performance from the perspective of analytical approach and design techniq

The book provides a detailed analysis of issues related to sub-threshold interconnect performance from the perspective of analytical approach and design techniq