In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semicond

In the "More than Moore" era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconducto

In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semicond

The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic in

Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D int