Electronic Packaging Interconnect Technology

Download or read book Electronic Packaging Interconnect Technology written by Kazuhiro Nogita and published by Trans Tech Publications Ltd. This book was released on 2018-04-13 with total page 210 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume presents for readers some selected papers from the 2017 Electronic Packaging Interconnect Technology Symposium (EPITS 2017, Fukuoka, Japan, November 1-2, 2017) and covers many aspects of topics such as implementing the Restriction of Hazardous Substances (ROHS), emerging interconnect materials and technologies, solders for interconnection at chip and package levels, stress-migration and mechanical properties of solder connections, research of properties of other materials and development of chemical technologies. The editors hope that this volume will provide the reader with a broad overview of the latest advances in the field of Electronic Packaging Interconnect Technology, and that will be a valuable reference source for further research.