This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and mate

This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and mate

The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the r

Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate d