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Type: BOOK - Published: 2023-10-17 - Publisher: Springer Nature
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Language: en
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Type: BOOK - Published: 2023-10-07 - Publisher: Springer
This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated cir
Language: en
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Pages: 417
Type: BOOK - Published: 2012-12-06 - Publisher: Springer Science & Business Media
This book is jointly authored by leading academic and industry researchers. The material is unique in that it spans IC interconnect topics ranging from IBM's re
Language: en
Pages: 126
Pages: 126
Type: BOOK - Published: 1997 - Publisher:
The semiconductor industry has developed at an unprecedented rate in the past two decades. Newer technology innovations have enabled the design of more complex
Language: en
Pages: 471
Pages: 471
Type: BOOK - Published: 2010-11-18 - Publisher: Springer Science & Business Media
Ultra-thin chips are the "smart skin" of a conventional silicon chip. This book shows how very thin and flexible chips can be fabricated and used in many new ap