Wafer Bonding

Wafer Bonding
Author :
Publisher : Springer Science & Business Media
Total Pages : 524
Release :
ISBN-10 : 3540210490
ISBN-13 : 9783540210498
Rating : 4/5 (498 Downloads)

Book Synopsis Wafer Bonding by : Marin Alexe

Download or read book Wafer Bonding written by Marin Alexe and published by Springer Science & Business Media. This book was released on 2004-05-14 with total page 524 pages. Available in PDF, EPUB and Kindle. Book excerpt: During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.


Wafer Bonding Related Books

Wafer Bonding
Language: en
Pages: 524
Authors: Marin Alexe
Categories: Science
Type: BOOK - Published: 2004-05-14 - Publisher: Springer Science & Business Media

DOWNLOAD EBOOK

During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the mos
Handbook of Wafer Bonding
Language: en
Pages: 435
Authors: Peter Ramm
Categories: Technology & Engineering
Type: BOOK - Published: 2012-02-13 - Publisher: John Wiley & Sons

DOWNLOAD EBOOK

The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding a
Semiconductor Wafer Bonding
Language: en
Pages: 310
Authors: H. Baumgart
Categories: Technology & Engineering
Type: BOOK - Published: 2002 - Publisher: The Electrochemical Society

DOWNLOAD EBOOK

3D and Circuit Integration of MEMS
Language: en
Pages: 521
Authors: Masayoshi Esashi
Categories: Technology & Engineering
Type: BOOK - Published: 2021-03-16 - Publisher: John Wiley & Sons

DOWNLOAD EBOOK

3D and Circuit Integration of MEMS Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system
Semiconductor Wafer Bonding VIII : Science, Technology, and Applications
Language: en
Pages: 476
Authors:
Categories: Microelectromechanical systems
Type: BOOK - Published: 2005 - Publisher: The Electrochemical Society

DOWNLOAD EBOOK