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Type: BOOK - Published: 2015-12-09 - Publisher: Springer
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Pages: 481
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Type: BOOK - Published: 2015-07-06 - Publisher: McGraw Hill Professional
A comprehensive guide to 3D IC integration and packaging technology3D IC Integration and Packaging fully explains the latest microelectronics techniques for inc
Language: en
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Type: BOOK - Published: 2016-04-19 - Publisher: CRC Press
Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling
Language: en
Pages: 379
Pages: 379
Type: BOOK - Published: 2013-11-05 - Publisher: World Scientific
3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integr
Language: en
Pages: 192
Pages: 192
Type: BOOK - Published: 2017-02-08 - Publisher: Springer
This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore’s Law regime. Technical tra