TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model acco

Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3

This book constitutes the proceedings of the Third International Conference on Microelectronic Devices, Circuits and Systems, ICMDCS 2022, was held in Vellore,

Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate d