Through-silicon via (TSV)-based three-dimensional integrated circuits (3D ICs) are expected to be the breakthrough technology for keeping up with the scaling tr

This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimension

This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as verti

The advance of modern integrated circuit (IC) processes has supported increasing date rates on chip-to-chip communications in many consumer and professional app

The objective of this research is to explore the feasibility of addressing the major performance and reliability problems or issues, such as wirelength, stress-