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Language: en
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Type: BOOK - Published: 2021-12-29 - Publisher: John Wiley & Sons
Must-have reference on electronic packaging technology! The electronics industry is shifting towards system packaging technology due to the need for higher chip
Language: en
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Type: BOOK - Published: 2013-11-27 - Publisher: Springer Science & Business Media
The last twenty years have seen major advances in the electronics industry. Perhaps the most significant aspect of these advances has been the significant role
Language: en
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Type: BOOK - Published: 2010-12-03 - Publisher: Springer
Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain
Language: en
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Type: BOOK - Published: 2011 - Publisher: American Society of Mechanical Engineers
ASME Press Book Series on Electronic Packaging. Series Editor: Dereje Agonafer. This book provides the basic essentials and fundamentals of electronic packaging
Language: en
Pages: 633
Pages: 633
Type: BOOK - Published: 2011-01-05 - Publisher: Springer Science & Business Media
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic in