Electronic Packaging Materials Science X: Volume 515
| Author | : Daniel J. Belton |
| Publisher | : |
| Total Pages | : 288 |
| Release | : 1998-10 |
| ISBN-10 | : UCSD:31822026267385 |
| ISBN-13 | : |
| Rating | : 4/5 ( Downloads) |
Download or read book Electronic Packaging Materials Science X: Volume 515 written by Daniel J. Belton and published by . This book was released on 1998-10 with total page 288 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proceedings of the April 1998 symposium, which focused on high-density package solutions, with an emphasis on flip-chip technology. Topics include interfacial adhesion behavior, flip-chip interconnections, high-density substrates, thermomechanical behavior, and packaging reliability issues. Articles address the fracture of polymer interfaces and the delamination tendencies seen with flip-chip interconnections on organic substrates, under-bump metallurgy issues, and overall reliability issues. Annotation copyrighted by Book News, Inc., Portland, OR
