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Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 7
Language: en
Pages: 119

Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 7

Authors: K. Kondo
Categories:
Type: BOOK - Published: 2015 - Publisher: The Electrochemical Society

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Processing Materials of 3D Interconnects, Damascene, and Electronics Packaging 6
Language: en
Pages: 140

Processing Materials of 3D Interconnects, Damascene, and Electronics Packaging 6

Authors: K. Kondo
Categories: Science
Type: BOOK - Published: 2015-04-30 - Publisher: The Electrochemical Society

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Processing, Materials, and Integration of Damascene and 3D Interconnects
Language: en
Pages: 171

Processing, Materials, and Integration of Damascene and 3D Interconnects

Authors: J. C. Flake
Categories: Science
Type: BOOK - Published: 2010-04 - Publisher: The Electrochemical Society

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This issue focuses on recent advances in damascene interconnects and 3D interconnects.
Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 7
Language: en
Pages:

Processing Materials of 3D Interconnects, Damascene and Electronics Packaging 7

Authors: K. Kondi
Categories:
Type: BOOK - Published: 2015 - Publisher:

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Wafer Level 3-D ICs Process Technology
Language: en
Pages: 365

Wafer Level 3-D ICs Process Technology

Authors: Chuan Seng Tan
Categories: Technology & Engineering
Type: BOOK - Published: 2009-06-29 - Publisher: Springer Science & Business Media

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This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-pa