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Three Dimensional Wafer Level Interconnects for Integration in High Speed, Broadband Packaging and Circuit Applications

Authors: Swagata Riki Banerjee
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Heterogeneous Integrations
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Heterogeneous Integrations

Authors: John H. Lau
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Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different funct
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Handbook of Wafer Bonding

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The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding a
Advanced Packaging
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Advanced Packaging

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Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing
TSV 3D RF Integration
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TSV 3D RF Integration

Authors: Shenglin Ma
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TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-