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Wafer Scale Integration
Language: en
Pages: 536
Authors: Earl E. Swartzlander Jr.
Categories: Computers
Type: BOOK - Published: 1989 - Publisher: Springer

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Wafer Scale Integration (WSI) is the culmination of the quest for larger integrated circuits. In VLSI chips are developed by fabricating a wafer with hundreds o
Wafer-Level Integrated Systems
Language: en
Pages: 456
Authors: Stuart K. Tewksbury
Categories: Technology & Engineering
Type: BOOK - Published: 2012-12-06 - Publisher: Springer Science & Business Media

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From the perspective of complex systems, conventional Ie's can be regarded as "discrete" devices interconnected according to system design objectives imposed at
3D and Circuit Integration of MEMS
Language: en
Pages: 44
Authors: Masayoshi Esashi
Categories: Technology & Engineering
Type: BOOK - Published: 2021-07-19 - Publisher: John Wiley & Sons

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3D and Circuit Integration of MEMS Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system
Frontiers of Computing Systems Research
Language: en
Pages: 394
Authors: Stuart K. Tewksbury
Categories: Computers
Type: BOOK - Published: 2012-12-06 - Publisher: Springer Science & Business Media

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Computing systems researchers confront two serious problems. (1) The increasingly monolithic, or pseudo-monolithic, integration of complex com puting functions
Wafer-Level Chip-Scale Packaging
Language: en
Pages: 336
Authors: Shichun Qu
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Type: BOOK - Published: 2014-09-10 - Publisher: Springer

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Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, rel