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A comprehensive guide to 3D IC integration and packaging technology 3D IC Integration and Packaging fully explains the latest microelectronics techniques for in
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A comprehensive guide to TSV and other enabling technologies for 3D integration Written by an expert with more than 30 years of experience in the electronics in
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Type: BOOK - Published: 2013-11-05 - Publisher: World Scientific
3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integr
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The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and
