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Advances in Embedded and Fan-Out Wafer Level Packaging Technologies
Language: en
Pages: 576
Authors: Beth Keser
Categories: Technology & Engineering
Type: BOOK - Published: 2019-02-12 - Publisher: John Wiley & Sons

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Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and mate
Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces
Language: en
Pages: 324
Authors: Beth Keser
Categories: Technology & Engineering
Type: BOOK - Published: 2021-12-29 - Publisher: John Wiley & Sons

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Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologi
Fan-Out Wafer-Level Packaging
Language: en
Pages: 319
Authors: John H. Lau
Categories: Technology & Engineering
Type: BOOK - Published: 2018-04-05 - Publisher: Springer

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This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the cur
Antenna-in-Package Technology and Applications
Language: en
Pages: 416
Authors: Duixian Liu
Categories: Technology & Engineering
Type: BOOK - Published: 2020-03-31 - Publisher: John Wiley & Sons

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A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an
Heterogeneous Integrations
Language: en
Pages: 381
Authors: John H. Lau
Categories: Technology & Engineering
Type: BOOK - Published: 2019-04-03 - Publisher: Springer

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Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different funct