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Language: en
Pages: 576
Pages: 576
Type: BOOK - Published: 2019-02-12 - Publisher: John Wiley & Sons
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Language: en
Pages: 324
Pages: 324
Type: BOOK - Published: 2021-12-29 - Publisher: John Wiley & Sons
Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologi
Language: en
Pages: 319
Pages: 319
Type: BOOK - Published: 2018-04-05 - Publisher: Springer
This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the cur
Language: en
Pages: 416
Pages: 416
Type: BOOK - Published: 2020-03-31 - Publisher: John Wiley & Sons
A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an
Language: en
Pages: 381
Pages: 381
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Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different funct