Area Array Packaging Handbook

Area Array Packaging Handbook
Author :
Publisher : McGraw Hill Professional
Total Pages : 832
Release :
ISBN-10 : UOM:39015053514967
ISBN-13 :
Rating : 4/5 ( Downloads)

Book Synopsis Area Array Packaging Handbook by : Ken Gilleo

Download or read book Area Array Packaging Handbook written by Ken Gilleo and published by McGraw Hill Professional. This book was released on 2002 with total page 832 pages. Available in PDF, EPUB and Kindle. Book excerpt: *Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)


Area Array Packaging Handbook Related Books

Area Array Packaging Handbook
Language: en
Pages: 832
Authors: Ken Gilleo
Categories: Business & Economics
Type: BOOK - Published: 2002 - Publisher: McGraw Hill Professional

DOWNLOAD EBOOK

*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (C
Area Array Interconnection Handbook
Language: en
Pages: 1250
Authors: Karl J. Puttlitz
Categories: Technology & Engineering
Type: BOOK - Published: 2012-12-06 - Publisher: Springer Science & Business Media

DOWNLOAD EBOOK

Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third
Area Array Packaging Processes
Language: en
Pages: 276
Authors: Ken Gilleo
Categories: Technology & Engineering
Type: BOOK - Published: 2004 - Publisher: McGraw Hill Professional

DOWNLOAD EBOOK

This engineering reference covers the most important assembly processes in modern electronic packaging. It includes flip chip assembly and processes, die-attach
Microelectronics Packaging Handbook
Language: en
Pages: 662
Authors: Rao Tummala
Categories: Computers
Type: BOOK - Published: 1997-01-31 - Publisher: Springer Science & Business Media

DOWNLOAD EBOOK

This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design method
Microelectronics Packaging Handbook
Language: en
Pages: 1060
Authors: R.R. Tummala
Categories: Computers
Type: BOOK - Published: 2013-11-27 - Publisher: Springer Science & Business Media

DOWNLOAD EBOOK

Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to pro