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Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition
Language: en
Pages: 848
Authors: Rao Tummala
Categories: Technology & Engineering
Type: BOOK - Published: 2019-09-02 - Publisher: McGraw-Hill Education

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Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition
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A fully updated, comprehensive guide to electronic packaging technologies This thoroughly revised resource offers rigorous and complete coverage of microsystems
Fundamentals of Microsystems Packaging
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Authors: Rao Tummala
Categories: Technology & Engineering
Type: BOOK - Published: 2001-05-08 - Publisher: McGraw Hill Professional

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LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only b
Advanced Driver Assistance Systems and Autonomous Vehicles
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This book provides a comprehensive reference for both academia and industry on the fundamentals, technology details, and applications of Advanced Driver-Assista
System on Package
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System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bul