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Pages: 678
Type: BOOK - Published: 1996 - Publisher: McGraw Hill Professional
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Language: en
Pages: 374
Pages: 374
Type: BOOK - Published: 2012-12-06 - Publisher: Springer Science & Business Media
One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a repl
Language: en
Pages: 60
Pages: 60
Type: BOOK - Published: 2017-04 - Publisher:
Solder has been a loyal servant of the electronics manufacturing industry for years; however, like any aging servant, the efficacy of solder has been waning as
Language: en
Pages: 288
Pages: 288
Type: BOOK - Published: 2002-01-24 - Publisher: Elsevier
Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its i
Language: en
Pages: 1044
Pages: 1044
Type: BOOK - Published: 2004-02-27 - Publisher: CRC Press
This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end a