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Modern Solder Technology for Competitive Electronics Manufacturing
Language: en
Pages: 678
Authors: Jennie S. Hwang
Categories: Technology & Engineering
Type: BOOK - Published: 1996 - Publisher: McGraw Hill Professional

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Introduction Advanced Surface Mount Technology and Die Attach Techniques Solder Material Soldering Chemistry Solderability Microstructure of Solders Aqueous-Cle
Solder Paste in Electronics Packaging
Language: en
Pages: 374
Authors: Jennie Hwang
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Type: BOOK - Published: 2012-12-06 - Publisher: Springer Science & Business Media

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One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a repl
Solderless Assembly for Electronics
Language: en
Pages: 60
Authors: Joseph Fjelstad
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Type: BOOK - Published: 2017-04 - Publisher:

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Solder has been a loyal servant of the electronics manufacturing industry for years; however, like any aging servant, the efficacy of solder has been waning as
Reflow Soldering Processes
Language: en
Pages: 288
Authors: Ning-Cheng Lee
Categories: Technology & Engineering
Type: BOOK - Published: 2002-01-24 - Publisher: Elsevier

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Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its i
Handbook of Lead-Free Solder Technology for Microelectronic Assemblies
Language: en
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Authors: Karl J. Puttlitz
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This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end a