Modern Solder Technology for Competitive Electronics Manufacturing
| Author | : Jennie S. Hwang |
| Publisher | : McGraw-Hill Professional Publishing |
| Total Pages | : 680 |
| Release | : 1996 |
| ISBN-10 | : UOM:39015037431668 |
| ISBN-13 | : |
| Rating | : 4/5 ( Downloads) |
Download or read book Modern Solder Technology for Competitive Electronics Manufacturing written by Jennie S. Hwang and published by McGraw-Hill Professional Publishing. This book was released on 1996 with total page 680 pages. Available in PDF, EPUB and Kindle. Book excerpt: Introduction Advanced Surface Mount Technology and Die Attach Techniques Solder Material Soldering Chemistry Solderability Microstructure of Solders Aqueous-Cleaning Manufacture No-Clean Manufacture Protective and Reactive Atmosphere Soldering Surface Mount Fine Pitch Technology Surface Mount-BGA/PAC Technology Soldering Methodology and Equipment Soldering and Soldering Related Issues Strengthened Solders Lead-Free Solders Solder Joint Failure Mode Solder Joint Failure Assessment-Case Studies Solder Joint Quality and Reliability New and Emerging Specifications and Standards Future Trends.
