Particle Scale Modeling of Material Removal and Surface Roughness in Chemical Mechanical Polishing
| Author | : Suresh Babu Yeruva |
| Publisher | : |
| Total Pages | : |
| Release | : 2005 |
| ISBN-10 | : OCLC:76786526 |
| ISBN-13 | : |
| Rating | : 4/5 ( Downloads) |
Book Synopsis Particle Scale Modeling of Material Removal and Surface Roughness in Chemical Mechanical Polishing by : Suresh Babu Yeruva
Download or read book Particle Scale Modeling of Material Removal and Surface Roughness in Chemical Mechanical Polishing written by Suresh Babu Yeruva and published by . This book was released on 2005 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The predictions of the model show a reasonable agreement with the experimental data. The model is validated for oxide and metal CMP systems. The PERC II model not only predicts the overall removal rate, but also the surface roughness of the polished wafer in selected systems. The developed model can be used to optimize the current CMP systems and provide insights into future CMP endeavors.
