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Type: BOOK - Published: 2001 - Publisher: The Electrochemical Society
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The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding a
Language: en
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Type: BOOK - Published: 2001 - Publisher: The Electrochemical Society
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Type: BOOK - Published: 2013-03-09 - Publisher: Springer Science & Business Media
The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration
Language: en
Pages: 524
Pages: 524
Type: BOOK - Published: 1991 - Publisher:
