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Semiconductor Wafer Bonding 10: Science, Technology, and Applications
Language: en
Pages: 588
Authors:
Categories: Microelectromechanical systems
Type: BOOK - Published: 2008-10 - Publisher: The Electrochemical Society

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This issue of ECS Transactions on Semiconductor Wafer Bonding will cover the state-of-the-art R&D results of the last 2 years in the field of semiconductor wafe
Semiconductor Wafer Bonding : Science, Technology, and Applications V
Language: en
Pages: 498
Authors: Charles E. Hunt
Categories: Technology & Engineering
Type: BOOK - Published: 2001 - Publisher: The Electrochemical Society

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Wafer Bonding
Language: en
Pages: 524
Authors: Marin Alexe
Categories: Science
Type: BOOK - Published: 2004-05-14 - Publisher: Springer Science & Business Media

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During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the mos
Semiconductor Wafer Bonding VII : Science, Technology, and Applications
Language: en
Pages: 408
Authors:
Categories: Technology & Engineering
Type: BOOK - Published: 2003 - Publisher: The Electrochemical Society

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Semiconductor Wafer Bonding VIII : Science, Technology, and Applications
Language: en
Pages: 476
Authors:
Categories: Microelectromechanical systems
Type: BOOK - Published: 2005 - Publisher: The Electrochemical Society

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