In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating,

The field of electronic packaging continues to grow at an amazing rate. To be successful in this field requires analytical skills, a foundation in mechanical en

Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly comple

The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In

With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor i