Thermal-driven Placement in 3-dimensional Integrated Circuits

Thermal-driven Placement in 3-dimensional Integrated Circuits
Author :
Publisher :
Total Pages : 182
Release :
ISBN-10 : UCAL:X74852
ISBN-13 :
Rating : 4/5 ( Downloads)

Book Synopsis Thermal-driven Placement in 3-dimensional Integrated Circuits by : Wei Li

Download or read book Thermal-driven Placement in 3-dimensional Integrated Circuits written by Wei Li and published by . This book was released on 2007 with total page 182 pages. Available in PDF, EPUB and Kindle. Book excerpt:


Thermal-driven Placement in 3-dimensional Integrated Circuits Related Books

Thermal-driven Placement in 3-dimensional Integrated Circuits
Language: en
Pages: 182
Authors: Wei Li
Categories:
Type: BOOK - Published: 2007 - Publisher:

DOWNLOAD EBOOK

Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
Language: en
Pages: 573
Authors: Sung Kyu Lim
Categories: Technology & Engineering
Type: BOOK - Published: 2012-11-27 - Publisher: Springer Science & Business Media

DOWNLOAD EBOOK

This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimension
Three-Dimensional Integrated Circuit Design
Language: en
Pages: 770
Authors: Vasilis F. Pavlidis
Categories: Technology & Engineering
Type: BOOK - Published: 2017-07-04 - Publisher: Newnes

DOWNLOAD EBOOK

Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in cir
Three-Dimensional Integrated Circuit Design
Language: en
Pages: 292
Authors: Yuan Xie
Categories: Technology & Engineering
Type: BOOK - Published: 2009-12-02 - Publisher: Springer Science & Business Media

DOWNLOAD EBOOK

We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law
Placement for Fast and Reliable Through-silicon-via (TSV) Based 3D-IC Layouts
Language: en
Pages:
Authors: Krit Athikulwongse
Categories: Integrated circuits
Type: BOOK - Published: 2012 - Publisher:

DOWNLOAD EBOOK

The objective of this research is to explore the feasibility of addressing the major performance and reliability problems or issues, such as wirelength, stress-