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Language: en
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Type: BOOK - Published: 2015-12-09 - Publisher: Springer
This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then pr
Language: en
Pages: 481
Pages: 481
Type: BOOK - Published: 2015-07-06 - Publisher: McGraw Hill Professional
A comprehensive guide to 3D IC integration and packaging technology3D IC Integration and Packaging fully explains the latest microelectronics techniques for inc
Language: en
Pages: 798
Pages: 798
Type: BOOK - Published: 2011-09-22 - Publisher: John Wiley & Sons
The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the r
Language: en
Pages: 770
Pages: 770
Type: BOOK - Published: 2017-07-04 - Publisher: Newnes
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in cir
Language: en
Pages: 379
Pages: 379
Type: BOOK - Published: 2013-11-05 - Publisher: World Scientific
3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integr